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何艳
 


一、个人基本情况

何艳副教授,博士

二、学习、工作经历

2024.01-至今

辽宁石油化工大学

副教授

欧洲杯买球网站

2020.08-2023.12

辽宁石油化工大学

讲师

欧洲杯买球网站

2016.09-2019.12

沈阳工业大学

博士

机械工程专业

2014.09-2016.07

沈阳工业大学

硕士

机械工程专业

2010.09-2014.07

辽宁石油化工大学

本科

机械设计制造及其自动化专业

三、学术兼职

辽宁石油化工大学学报青年编委

四、研究方向

精密加工与特种加工、半导体材料的高效加工技术、机械部件的摩擦学和磨损分析、纳米制造

五、研究生招生专业

机械工程等相关专业

六、主要业绩

七、近期主持的主要科研项目

1、辽宁省博士科研启动基金计划项目超声振动-光催化复合辅助抛光碳化硅晶体机理及损伤研究(编号. 2022-BS-292(主持)

2、辽宁省教育厅科学技术研究项目电助光催化抛光单晶碳化硅机理及损伤研究(编号. LJKZ0383(主持)

3、辽宁石油化工大学引进人才科研启动基金光催化辅助抛光单晶碳化硅技术与机理(编号. 2020XJJL-012(主持)

八、代表作

[1] Yan He, Zikai Gao, Meiling Tang, et al. Characteristics of atomic removal and mechanism of damage formation in vibration-assisted nano cutting of copper-nickel alloy[J]. Materials Today Communications, 2024, 38: 107668. SCI001133493000001

[2] Yan He, Zikai Gao, Meiling Tang, et al. Study on the atomic removal behavior and damage formation mechanism of nano cutting copper–nickel alloy with diamond tool [J]. Modelling and Simulation in Materials, 2024, 32(3): 32(3): 035011. SCI001163603200001

[3] Yan He, Wenzhi Tang, Peng Gao, et al. Nano-polishing characteristics in vibration-assisted CMP of single-crystal silicon carbide via molecular dynamics simulations[J]. Materials Science in Semiconductor Processing, 2023, 164: 107637. (SCI 检索号:001014715300001

[4] Yan He, Jingting Sun, Peng Gao, et al. Atomic removal mechanism of nano polishing for single-crystal AlN substrate via molecular dynamics[J]. Materials Science in Semiconductor Processing, 2023, 156: 107294. (SCI 检索号:000918309200001)

[5] Yan He, Meiling Tang, Lin Fan, et al. Investigation of the atomistic behavior in nanofinishing single-crystal aluminium nitride with hydroxyl radical •OH environment[J]. Computational Materials Science, 2022, 214: 111770. (SCI 检索号:000632795800002)

[6] Yan He, Zewei Yuan, Meiling Tang, et al. Mechanism of chemical and mechanical mutual promotion in photocatalysis-assisted chemical mechanical polishing for single-crystal SiC[J]. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2022, 236(24): 11464-11478.(SCI 检索号:000840244700001)

[7] Yan He, Zewei Yuan, Shuyuan Song, et al. Investigation on Material Removal Mechanisms in Photocatalysis-Assisted Chemical Mechanical Polishing of 4H-SiC Wafers[J]. International Journal of Precision Engineering and Manufacturing, 2021, 22(5): 951-963. (SCI 检索号:000632795800002)

[8] Yan He, Zewei Yuan, Kai Cheng, et al. Development of Electrical Enhanced Photocatalysis Polishing Slurry for Silicon Carbide Wafer[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, 2020, 234(3): 401-413. (SCI 检索号:000483297100001)

[9] Gao Xingjun, Li Xiang, He Yan*, et al. Investigation on Electrical Enhanced Photocatalysis Polishing of Single-Crystal Silicon Carbide Substrates[J]. International Journal of Precision Engineering and Manufacturing, 2022, 23(11): 1261-1274. (SCI 检索号:000853473300002)

[10] Fan Lin, Deng Zilong, He Yan*, et al. The effects of micro-texture shape on serrated chip geometry in the hardened steel AISI D2 cutting process[J]. Surface Topography-Metrology And Properties, 2022, 10(1): 015031. (SCI 检索号:000765957800001)

[11] 何艳,苑泽伟,段振云,等单晶碳化硅晶片高效超精密抛光工艺[J]哈尔滨工业大学学报,2019511115-121EI 检索号:20191306701036

[12] 何艳,苑泽伟,段振云,等单晶SiC的电助光催化抛光及去除机理研究[J]中国机械工程,2020314):403-409EI 检索号:21449769

[13] Zewei Yuan, Yan He, Quan Wen, et al. Environment-Friendly Chemical Mechanical Polishing Slurry for SiC Wafer[J]. Materials Science Forum. 2016, 874: 415-419. (EI 检索号:20164302933068)

[14] 何艳李翔高兴军. 基于Python语言的超薄金刚石切割片建模与SiC晶片切割仿真[J].金刚石与磨料磨具工程202343(05)621-631.

[15] 王一凡,唐文智, . 金刚石磨粒纳米加工单晶碳化硅非连续表面机理研究[J].金刚石与磨料磨具工程,202444(01)1-9.

[16] 何艳,苑泽伟,王坤,等基于金刚石微粉的单晶蓝宝石CMP工艺研究[J]机械设计与制造,2017(S1)95-97+101

[1] 何艳,苑泽伟,王坤,等单晶蓝宝石高效超精密加工技术研究[J]组合机床与自动化加工技术,2018(02)136-139

[2] 苑泽伟,何艳,郑鹏,等利用光催化氧化作用精密可控切割石墨烯带的方法与装置. 国家发明专利,专利号:ZL201710293060.02019.1授权

[17] Zewei Yuan, Yan He, Zhuji Jin, et al. Prediction of the Interface Temperature Rise in Tribochemical Polishing of CVD Diamond[J]. Chinese Journal of Mechanical Engineering, 2017, 30(2): 310-320. (SCI 检索号:000399019800010)

[18] Zewei Yuan, Yan He, Xingwei Sun, et al. UV-TiO2 photocatalysis-assisted chemical mechanical polishing 4H-SiC wafer[J]. Materials & Manufacturing Processes, 2018, 33(11): 1214-1222. (SCI 检索号:000430424000009)

[19] Zewei Yuan, Yan He, Kai Cheng, et al. Effect of Self-developed Graphene Lubricant on Tribological Behaviour of Silicon carbide/Silicon nitride interface[J]. Ceramics international, 2019, 45: 1011-1022. (SCI 检索号:000465058500067)

[20] Zewei Yuan, Kai Cheng, Yan He, et al. Investigation on smoothing silicon carbide wafer with a combined method of mechanical lapping and photocatalysis assisted chemical mechanical polishing[C]. ASME 2018 13th International Manufacturing Science and Engineering Conference, 2018, 4. (SCI 检索号:000451241400002).

[21] Shuyu Guo, Lin Fan, Yan He, et al. The influence of microtexture tools on the geometric morphology of serrated chips based on stress triaxiality[J]. Industrial Lubrication and Tribology, 2023: 708677. (SCI 检索号:000451241400002).

[22] Meiling Tang, Zewei Yuan, Yan He, et al. Cooperative roles of mechanical behavior and chemical reactions in mechanical chemical nano cutting of graphene assisted by ·OH radicals: quantum mechanics and reaction molecular dynamics simulations[J]. Physica Scripta, 2023, 99(1): 015405. (SCI 检索号:001127895300001).

九、联系方式

联系电话:15909835060

E-mail: 1422017226@qq.com


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