一、个人基本情况
何艳,女,副教授,博士。
二、学习、工作经历
2024.01-至今 | 辽宁石油化工大学 | 副教授 | 欧洲杯买球网站 |
2020.08-2023.12 | 辽宁石油化工大学 | 讲师 | 欧洲杯买球网站 |
2016.09-2019.12 | 沈阳工业大学 | 博士 | 机械工程专业 |
2014.09-2016.07 | 沈阳工业大学 | 硕士 | 机械工程专业 |
2010.09-2014.07 | 辽宁石油化工大学 | 本科 | 机械设计制造及其自动化专业 |
三、学术兼职
辽宁石油化工大学学报青年编委
四、研究方向
精密加工与特种加工、半导体材料的高效加工技术、机械部件的摩擦学和磨损分析、纳米制造
五、研究生招生专业
机械工程等相关专业
六、主要业绩
无
七、近期主持的主要科研项目
1、辽宁省博士科研启动基金计划项目“超声振动-光催化复合辅助抛光碳化硅晶体机理及损伤研究(编号. 2022-BS-292)”(主持)
2、辽宁省教育厅科学技术研究项目“电助光催化抛光单晶碳化硅机理及损伤研究(编号. LJKZ0383)”(主持)
3、辽宁石油化工大学引进人才科研启动基金“光催化辅助抛光单晶碳化硅技术与机理(编号. 2020XJJL-012)”(主持)
八、代表作
[1] Yan He, Zikai Gao, Meiling Tang, et al. Characteristics of atomic removal and mechanism of damage formation in vibration-assisted nano cutting of copper-nickel alloy[J]. Materials Today Communications, 2024, 38: 107668. (SCI:001133493000001)
[2] Yan He, Zikai Gao, Meiling Tang, et al. Study on the atomic removal behavior and damage formation mechanism of nano cutting copper–nickel alloy with diamond tool [J]. Modelling and Simulation in Materials, 2024, 32(3): 32(3): 035011. (SCI:001163603200001)
[3] Yan He, Wenzhi Tang, Peng Gao, et al. Nano-polishing characteristics in vibration-assisted CMP of single-crystal silicon carbide via molecular dynamics simulations[J]. Materials Science in Semiconductor Processing, 2023, 164: 107637. (SCI 检索号:001014715300001)
[4] Yan He, Jingting Sun, Peng Gao, et al. Atomic removal mechanism of nano polishing for single-crystal AlN substrate via molecular dynamics[J]. Materials Science in Semiconductor Processing, 2023, 156: 107294. (SCI 检索号:000918309200001)
[5] Yan He, Meiling Tang, Lin Fan, et al. Investigation of the atomistic behavior in nanofinishing single-crystal aluminium nitride with hydroxyl radical •OH environment[J]. Computational Materials Science, 2022, 214: 111770. (SCI 检索号:000632795800002)
[6] Yan He, Zewei Yuan, Meiling Tang, et al. Mechanism of chemical and mechanical mutual promotion in photocatalysis-assisted chemical mechanical polishing for single-crystal SiC[J]. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2022, 236(24): 11464-11478.(SCI 检索号:000840244700001)
[7] Yan He, Zewei Yuan, Shuyuan Song, et al. Investigation on Material Removal Mechanisms in Photocatalysis-Assisted Chemical Mechanical Polishing of 4H-SiC Wafers[J]. International Journal of Precision Engineering and Manufacturing, 2021, 22(5): 951-963. (SCI 检索号:000632795800002)
[8] Yan He, Zewei Yuan, Kai Cheng, et al. Development of Electrical Enhanced Photocatalysis Polishing Slurry for Silicon Carbide Wafer[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, 2020, 234(3): 401-413. (SCI 检索号:000483297100001)
[9] Gao Xingjun, Li Xiang, He Yan*, et al. Investigation on Electrical Enhanced Photocatalysis Polishing of Single-Crystal Silicon Carbide Substrates[J]. International Journal of Precision Engineering and Manufacturing, 2022, 23(11): 1261-1274. (SCI 检索号:000853473300002)
[10] Fan Lin, Deng Zilong, He Yan*, et al. The effects of micro-texture shape on serrated chip geometry in the hardened steel AISI D2 cutting process[J]. Surface Topography-Metrology And Properties, 2022, 10(1): 015031. (SCI 检索号:000765957800001)
[11] 何艳,苑泽伟,段振云,等.单晶碳化硅晶片高效超精密抛光工艺[J].哈尔滨工业大学学报,2019,51(1):115-121.(EI 检索号:20191306701036)
[12] 何艳,苑泽伟,段振云,等.单晶SiC的电助光催化抛光及去除机理研究[J].中国机械工程,2020,31(4):403-409.(EI 检索号:21449769)
[13] Zewei Yuan, Yan He, Quan Wen, et al. Environment-Friendly Chemical Mechanical Polishing Slurry for SiC Wafer[J]. Materials Science Forum. 2016, 874: 415-419. (EI 检索号:20164302933068)
[14] 何艳,李翔,高兴军,等. 基于Python语言的超薄金刚石切割片建模与SiC晶片切割仿真[J].金刚石与磨料磨具工程,2023,43(05):621-631.
[15] 王一凡,唐文智,何 艳,等. 金刚石磨粒纳米加工单晶碳化硅非连续表面机理研究[J].金刚石与磨料磨具工程,2024,44(01):1-9.
[16] 何艳,苑泽伟,王坤,等.基于金刚石微粉的单晶蓝宝石CMP工艺研究[J].机械设计与制造,2017,(S1):95-97+101
[1] 何艳,苑泽伟,王坤,等.单晶蓝宝石高效超精密加工技术研究[J].组合机床与自动化加工技术,2018,(02):136-139.
[2] 苑泽伟,何艳,郑鹏,等.利用光催化氧化作用精密可控切割石墨烯带的方法与装置. 国家发明专利,专利号:ZL201710293060.0,2019.1授权.
[17] Zewei Yuan, Yan He, Zhuji Jin, et al. Prediction of the Interface Temperature Rise in Tribochemical Polishing of CVD Diamond[J]. Chinese Journal of Mechanical Engineering, 2017, 30(2): 310-320. (SCI 检索号:000399019800010)
[18] Zewei Yuan, Yan He, Xingwei Sun, et al. UV-TiO2 photocatalysis-assisted chemical mechanical polishing 4H-SiC wafer[J]. Materials & Manufacturing Processes, 2018, 33(11): 1214-1222. (SCI 检索号:000430424000009)
[19] Zewei Yuan, Yan He, Kai Cheng, et al. Effect of Self-developed Graphene Lubricant on Tribological Behaviour of Silicon carbide/Silicon nitride interface[J]. Ceramics international, 2019, 45: 1011-1022. (SCI 检索号:000465058500067)
[20] Zewei Yuan, Kai Cheng, Yan He, et al. Investigation on smoothing silicon carbide wafer with a combined method of mechanical lapping and photocatalysis assisted chemical mechanical polishing[C]. ASME 2018 13th International Manufacturing Science and Engineering Conference, 2018, 4. (SCI 检索号:000451241400002).
[21] Shuyu Guo, Lin Fan, Yan He, et al. The influence of microtexture tools on the geometric morphology of serrated chips based on stress triaxiality[J]. Industrial Lubrication and Tribology, 2023: 708677. (SCI 检索号:000451241400002).
[22] Meiling Tang, Zewei Yuan, Yan He, et al. Cooperative roles of mechanical behavior and chemical reactions in mechanical chemical nano cutting of graphene assisted by ·OH radicals: quantum mechanics and reaction molecular dynamics simulations[J]. Physica Scripta, 2023, 99(1): 015405. (SCI 检索号:001127895300001).
九、联系方式
联系电话:15909835060
E-mail: 1422017226@qq.com